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inch-pound mil-m-38510/101j 07 february 2003 superseding mil-m-38510/101h 30 october 2001 military specification microcircuits, linear, operational amplifier, monolithic silicon this specification is approved for use by all departments and agencies of the department of defense. inactive for new design after 13 july 1995. 1. scope 1.1 scope . this specification covers the detail requirements for monolithic silicon, operational amplifiers. two product assurance classes and a choice of case outlines and lead finish are provided for each type and are reflected in the complete part number. for this product, the requirements of mi l-m-38510 have been superseded by mil-prf-38535, (see 6.3). 1.2 part number . the complete part number shall be in accordance with mil-prf-38535, and as specified herein.. 1.2.1 device types . the device types shall be as shown in the following: device type circuit 01 single operational amplifier - internally compensated 02 dual operational amplifier - internally compensated 03 single operational amplifier - externally compensated 04 single operational amplifier - externally compensated 05 dual operational amplifier - externally compensated 1 / 06 dual operational amplifier - externally compensated 1 / 07 single operational amplifier, high speed 08 dual operational amplifier - internally compensated 1.2.2 device class . the device class shall be the product assurance level as defined in mil-prf-38535. ______ 1 / device types 05 and 06 may be monolithic, or they may consist of two separate, independent die. beneficial comments (recommendations, additions, deletions) and any pertinent data which may be use in improving this document should be addressed to: commander, defense supply center columbus, attn: dscc-vas, 3990 east broad st., columbus, oh 43216-5000, by using the standardization document improvement proposal (dd form 1426) appearing at the end of this document or by letter. amsc n/a fsc 5962 distribution statement a . approved for public release; distribution is unlimited.
mil-m-38510/101j 1.2.3 case outlines . the case outlines shall be designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style a 2 / gdfp5-f14 or cdfp6-f14 14 flat pack b 2 / gdfp4-14 14 flat pack c gdip1-t14 or cdip2-t14 14 dual-in-line d gdfp1-f14 or cdfp2-f14 14 flat pack e gdip1-t16 or cdip2-t16 16 dual-in-line f gdfp2-f16 or cdfp3-f16 16 flat pack g macy1-x8 8 can h gdfp1-f10 or cdfp2-f10 10 flat pack i macy1-x10 10 can p gdip1-t8 or cdip2-t8 8 dual-in-line z gdfp1-g10 10 flat pack with gullwing leads 2 cqcc1-n20 20 square leadless chip carrier 1.3 absolute maximum ratings . supply voltage range (v cc )............................................................................. 22 v dc 3 / input voltage range ......................................................................................... 20 v dc 4 / differential in put voltage range ....................................................................... 30 v dc 5 / input current range ......................................................................................... -0.1 ma to +10 m a storage temperat ure range ............................................................................. -65 c to +150 c output short-circuit duration ............................................................................ unlim ited 6 / lead temperature (solde ring, 60 seco nds) ..................................................... +300 c junction temperature (t j ) ............................................................................... +175 c 7 / 1.4 recommended operating conditions . supply voltage (v cc ) ...................................................................................... 5 v dc to 20 v dc ambient temperature range (t a ) .................................................................... -55 c to +125 c ______ 2 / inactive package case outline. 3 / voltages in excess of these may be applied for short-term tests if voltage difference does not exceed 44 volts. 4 / for supply voltages less than 20 v dc, the absolute maximum input voltage is equal to the supply voltage. 5 / for device types 04, 06, and 07 only, this rating is 1.0 v unless resistances of 2 k ? or greater are inserted in series with the inputs to limit current in the input shunt diodes to the maximum allowable value. 6 / short circuit may be to ground or either supply. rating applies to +125 c case temperature or +75 c ambient temperature. 7 / for short term test (in the specific burn-in and life test configuration when required and up to 168 hours maximum) t j = +275 c. 2
mil-m-38510/101j 1.5 power and thermal characteristics . case outlines maximum allowable power dissipation maximum jc maximum ja a,b,d 350 mw at t a = +125 c 60 c/w 140 c/w c,e,p 400 mw at t a = +125 c 35 c/w 120 c/w g 330 mw at t a = +125 c 40 c/w 150 c/w i 350 mw at t a = +125 c 40 c/w 140 c/w h 330 mw at t a = +125 c 60 c/w 150 c/w f 400 mw at t a = +125 c 35 c/w 120 c/w z 330 mw at t a = +125 c 21 c/w 225 c/w still air 142 c/w 500 lfpm 2 8 / at t a = +125 c 60 c/w 120 c/w 2. applicable documents 2.1 government documents . 2.1.1 specifications, standards, and handbooks . the following specifications and standards form a part of this specification to the extent specified herein. unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. department of defense specifications mil-prf-38535 - integrated circuits (mic rocircuits) manufacturing, general specification for. department of defense standards mil-std-883 - test method standard for microelectronics. mil-std-1835 - interface standard electronic component outlines. (copies of these documents are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094 or http://astimage.da ps.dla.mil/quicksearch/ or www.dodssp.daps.mil.) 2.2 order of precedence . in the event of a conflict between the text of this specification and the references cited herein the text of this document shall takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ______ 8 / p d = 102 mw for device type 01. p d = 75 mw for device type 03. p d = 149 mw for device type 04. 3
mil-m-38510/101j 3. requirements 3.1 qualification . microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 item requirements . the individual item requirements shall be in accordance with mil-prf-38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 3.3 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38535 and herein. 3.3.1 terminal connections . the terminal connections shall be as specified on figure 1. 3.3.2 schematic circuits . the schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (dscc-vas) upon request. 3.3.3 case outlines . the case outlines shall be as specified in 1.2.3. 3.4 lead material and finish . lead material and finish shall be in accordance with mil-prf-38535 (see 6.6). 3.5 electrical performance characteristics . the following electrical performance characteristics apply over the full operating ambient temperature range of -55 c to +125 c and for supply voltages 5 v dc to 20 v dc, unless otherwise specified (see table i). 3.5.1 offset null circuits . each amplifier having nulling inputs (device types 01, 02, 03, 05, and 07) shall be capable of being nulled 1 mv beyond the specified offset voltage limits for -55 c t a +125 c using the circuits of figure 2. 3.5.2 frequency compensation . device types 01, 02, 07, and 08 shall be free of oscillation when operated in a unity gain non-inverting mode with no external compensation and a source resistance of 10 k ? , and when operated in any test condition specified herein. device types 03, 04, 05, and 06 shall be free from oscillation when compensated with a 30 pf capacitor for all gain configurations or a 3 pf capacitor when used with a gain of 10. 3.6 rebonding . rebonding shall be in accordance with mil-prf-38535. 3.7 electrical test requirements . electrical test requirements for each device class shall be the subgroups specified in table ii. the electrical tests for each subgroup are described in table iii. 3.8 marking . marking shall be in accordance with mil-prf-38535. 3.9 microcircuit group assignment . the devices covered by this specification shall be in microcircuit group number 49 (see mil-prf-38535, appendix a). 4
mil-m-38510/101j table i. electrical performance characteristics . 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max input offset voltage v io r s = 50 ? 2 / 1 01,02, 08 -3 +3 mv 03,05 -2 +2 04,06 -0.5 +0.5 07 -4 +4 2,3 01,02, 08 -4 +4 03,05 -3 +3 04,06 -1 +1 07 -6 +6 input offset voltage temperature sensitivity ? v io / ? t 2 01,02, 08 -15 +15 v/ c 03,05 -18 +18 04,06 -5 +5 07 -50 +50 3 01,02, 03,05 -15 +15 04,06 -5 +5 07 -50 +50 08 -20 20 see footnotes at end of table. 5
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max input offset current i io 2 / 1 01,02, 08 -30 +30 na 03,05 -10 +10 04,06 -0.2 +0.2 07 -40 +40 2,3 01,02, 08 -70 +70 03,05 -20 +20 04,06 -0.4 +0.4 07 -80 +80 input offset current temperature sensitivity ? i io / ? t 2 01,02, 08 -500 +500 pa/ c 03,05 -200 +200 04,06 -2.5 +2.5 07 -1000 +1000 3 01,02, 08 -200 +200 03,05 -100 +100 04,06 -2.5 +2.5 07 -1000 +1000 see footnotes at end of table. 6
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max input bias current +i ib 2 / 1,2 01,02, 08 -0.1 +110 na 03,05 -0.1 +75 07 -0.1 +250 1 04,06 -0.1 +2.0 2 -1.0 +2.0 3 01,02, 08 -0.1 +265 03,05 -0.1 +100 04,06 -0.1 +3.0 07 -0.1 +400 -i ib 1,2 01,02, 08 -0.1 +110 03,05 -0.1 +75 07 -0.1 +250 1 04,06 -0.1 +2.0 2 -1.0 +2.0 3 01,02, 08 -0.1 +265 03,05 -0.1 +100 04,06 -0.1 +3.0 07 -0.1 +400 see footnotes at end of table. 7
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max power supply rejection ratio +psrr +v cc = 10 v, r s = 50 ? , 1 01,02, 03,05, 08 -50 +50 v/v -v cc = -20 v 04,06 -16 +16 07 -100 +100 2,3 01,02, 03,05, 08 -100 +100 04,06 -16 +16 07 -150 +150 -psrr +v cc = 20 v, r s = 50 ? , 1 01,02, 03,05, 08 -50 +50 -v cc = -10 v 04,06 -16 +16 07 -100 +100 2,3 01,02, 03,05, 08 -100 +100 04,06 -16 +16 07 -150 +150 input voltage common mode rejection cmr v cc = 20 v, v in = 15 v, r s = 50 ? 1,2,3 01,02, 03,05, 07,08 80 db 04,06 96 see footnotes at end of table. 8
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max adjustment for input 3 / offset voltage v io adj(+) v cc = 20 v 1,2,3 01,02, 08 +5 mv 03,05 +4 04,06 no external adj 07 +7 adjustment for input 3 / offset voltage v io adj(-) v cc = 20 v 1,2,3 01,02, 08 -5 mv 03,05 -4 04,06 no extern al adj 07 -7 output short-circuit current (for positive i os (+) v cc = 15 v, t 25 ms 4 / 1,2,3 01,02, 03,05, 08 -60 ma output) 04,06 -15 07 -65 output short-circuit current (for negative i os (-) v cc = 15 v, t 25 ms 4 / 1,2,3 01,02, 03,05, 08 +60 ma output) 04,06 +15 1,2 07 +65 3 +80 see footnotes at end of table. 9
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max supply current i cc v cc = 15 v 5 / 1 01,02, 08 +3.8 ma 03,05 +3 04,06 +0.6 07 +8 2 01,02, 08 +3.4 03,05 +2.5 04,06 +0.6 07 +7 3 01,02, 08 +4.2 03,05 +3.5 04,06 +0.8 07 +9 output voltage swing (maximum) v op v cc = 20 v, r l = 10 k ? 4,5,6 01-06, 08 16 v 07 17 v cc = 20 v, r l = 2 k ? 01,02, 03,05, 08 15 04,06 not speci- fied 07 16 see footnotes at end of table. 10
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max open loop voltage gain 6 / (single ended) a vs ( ) v cc = 20 v, 7 / r l = 2 k ? , 10 k ? 4 01,02, 03,05, 07,08 50 v/mv v out = 15 v 04,06 80 5,6 01,02, 03,05, 08 25 04,06 40 07 32 open loop voltage gain 6 / (single ended) a vs v cc = 5 v, 7 / r l = 2 k ? , 10 k ? 4,5,6 01,02, 03,05, 07,08 10 v/mv v out = 2 v 04,06 20 transient response rise time tr (tr) see figure 4 8 / 7,8a,8b 01,02, 03,05, 08 +800 ns 04,06 +1000 07 +40 transient response overshoot tr (os) see figure 4 8 / 7,8a,8b 01,02, 03,05, 08 +25 % 04,06, 07 +50 slew rate 9 / sr(+) v in = 5 v, a v = 1, 7,8b 01,02, 08 +0.3 v/ s see figure 4 03,05 10 / 04,06 +0.05 07 +40 see footnotes at end of table. 11
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max slew rate 9 / sr(+) v in = 5 v, a v = 1, 8a 01,02, 03,05, 08 +0.3 v/ s see figure 4 04,06 +0.05 07 +30 slew rate 9 / sr(-) v in = 5 v, a v = 1, 7,8b 01,02, 08 +0.3 v/ s see figure 4 03,05 10 / 04,06 +0.05 07 +40 8a 01,02, 03,05, 08 +0.3 04,06 +0.05 07 +30 settling time 11 / t s (+) see figure 4 12 07 800 ns 13a,13b 1200 t s (-) 12 800 13a,13b 1200 channel separation cs v cc = 20 v, see figure 5, t a = +25 c 7 02,05, 06,08 80 db see footnotes at end of table. 12
mil-m-38510/101j table i. electrical performance characteristics ? continued. 1 / test symbol conditions -55 c t a +125 c see figure 3 group a subgroups device type limits unit unless otherwise specified min max noise (referred to input) broadband ni(bb) v cc = 20 v, t a = +25 c, bandwidth = 5 khz 7 01-06, 08 15 vrms 07 25 noise (referred to input) popcorn ni(pc) v cc = 20 v, t a = +25 c, bandwidth = 5 khz 7 01,02, 04,06, 08 40 vpk 03,05, 07 80 1 / for devices marked with the ?q? certification mark, the parameters listed herein maybe guaranteed if not tested to the limits specified herein in accordance with the manufacturer?s qm plan. 2 / tests at common mode v cm = 0 v, v cm = -15 v, and v cm = +15 v. 3 / v io(adj) is not performed on device type 02, case i only, or on device type 08 for either case g or p. 4 / continuous short circuit limits will be considerably less than the indicated test limits. continuous i os at t a +75 c will cause t j to exceed the maximum of +175 c. for dual devices, i os is measured one channel at a time. 5 / value shown is for single devices (01, 03, 04) only. for dual devices (02, 05, 06, and 08) this limit is for single devices. 6 / note that gain is not specified at v io(adj) extremes. some gain reduction is usually seen at v io(adj) extremes. for closed loop applications (closed loop gain less than 1,000), the open loop tests (avs) prescribed herein should guarantee a positive, reasonably linear, transfer characteristic. they do not, however, guarantee that the open loop gain is linear, or even positive, over the operating range. if either of these requirements exist (positive open loop gain or open loop gain linearity), they should be specified in the individual procurement document as additional requirements. 7 / r l = 10 k ? only for device types 04 and 06. 8 / for transient response tests, c f = 10 pf for device types 01, 02, 03, 04, 05, 06, and 08. device type 07, c f = 47 pf. c f includes the effects of stray capacitance. 9 / minimum limit for device 08 is 0.4 v/ s at all temperatures. 10 / minimum limits for device types 03 and 05 are 0.2 v/ s at -55 c and 0.3 v/ s at both +25 c and +125 c. 11 / settling time is waived for method 5004, mil-std-883 except for device type 07. 13
mil-m-38510/101j table ii. electrical test requirements . mil-prf-38535 test requirements subgroups (see table iii) class s devices class b devices interim electrical parameters 1 1 final electrical test parameters 1 / 1,2,3,4 1,2,3,4 group a test requirements 1,2,3,4,5,6, 7,8a,8b,12, 13a,13b 1,2,3,4,5,6,7 group c end point electrical parameters 1,2,3, and table iv delta limits 1 and table iv delta limits additional electrical subgroups for group c periodic inspections not applicable 8a,8b,12, 13a,13b group d end point electrical parameters 1,2,3 1 1 / pda applies to subgroup 1. 4. verification. 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer?s quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as function as described herein. 4.2 screening . screening shall be in accordance with mil-prf-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. the following additional criteria shall apply: a. the burn-in test duration, test condition, and test tem perature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-38535. the burn-in test circuit shall be maintained under document control by the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. b. interim and final electrical test parameters shall be as specified in table ii, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. additional screening for space level product shall be as specified in mil-prf-38535. 14
mil-m-38510/101j device type 01 case outlines a,b,c,d g and p h 2 terminal number terminal symbol 1 nc offset null nc nc 2 nc -input offset null offset null (-) 3 offset null +input -input nc 4 -input -v cc +input nc 5 +input offset null -v cc -input 6 -v cc output offset null nc 7 nc +v cc output +input 8 nc nc +v cc nc 9 offset null --- nc nc 10 output --- nc -v cc 11 +v cc --- --- nc 12 nc --- --- offset null (+) 13 nc --- --- nc 14 nc --- --- nc 15 --- --- --- output 16 --- --- --- nc 17 --- --- --- +v cc 18 --- --- --- nc 19 --- --- --- nc 20 --- --- --- nc nc = no connection figure 1. terminal connections . 15
mil-m-38510/101j device type 02 03 case outlines a,b,c,d i c g and p h terminal number terminal symbol 1 -input a output a nc offset null / comp nc 2 +input a +v cc (a) see note 2 nc -input offset null / comp 3 offset null a -input a offset null / comp +input -input 4 -v cc +input a -input -v cc +input 5 offset null b -v cc +input offset null -v cc 6 +input b +input b -v cc output offset null 7 -input b -input b nc +v cc output 8 offset null b +v cc (b) see note 2 nc comp +v cc 9 +v cc (b) see note 2 output b offset null --- comp 10 output b nc output --- nc 11 nc --- +v cc --- --- 12 output a --- comp --- --- 13 +v cc (a) see note 2 --- nc --- --- 14 offset null a --- nc --- --- 15 --- --- --- --- --- 16 --- --- --- --- --- 17 --- --- --- --- --- 18 --- --- --- --- --- 19 --- --- --- --- --- 20 --- --- --- --- --- nc = no connection figure 1. terminal connections ? continued. 16
mil-m-38510/101j device type 03 04 case outlines 2 c g and p h 2 terminal number terminal symbol 1 nc nc input comp nc nc 2 offset null (-) input comp -input guard input comp 3 nc guard +input -input nc 4 nc -input -v cc +input nc 5 -input +input nc guard -input 6 nc guard output -v cc nc 7 +input -v cc +v cc output +input 8 nc nc output comp +v cc nc 9 nc nc --- output comp nc 10 -v cc output --- input comp -v cc 11 nc +v cc --- --- nc 12 offset null (+) output comp --- --- nc 13 nc nc --- --- nc 14 nc nc --- --- nc 15 output --- --- --- output 16 nc --- --- --- nc 17 +v cc --- --- --- +v cc 18 nc --- --- --- nc 19 nc --- --- --- nc 20 freq comp --- --- --- output comp nc = no connection figure 1. terminal connections ? continued. 17
mil-m-38510/101j device type 05 06 07 case outlines e and f e and f c g and p terminal number terminal symbol 1 +v cc (a) see note 5 +v cc (a) see note 5 nc comp a / offset null 2 comp a output comp a nc -input 3 offset null / comp input comp a comp a / offset null +input 4 -input a -input a -input -v cc 5 +input a +input a +input comp b / offset null 6 -v cc -v cc -v cc output 7 offset null b nc nc +v cc 8 output b output b nc comp c 9 +v cc (b) see note 5 +v cc (b) see note 5 comp b / offset null --- 10 comp b output comp b output --- 11 offset null / comp b input comp b +v cc --- 12 -input b -input b comp c --- 13 +input b +input b nc --- 14 offset null a nc nc --- 15 nc nc --- --- 16 output a output a --- --- nc = no connection figure 1. terminal connections ? continued. 18
mil-m-38510/101j device types 07 08 case outlines h g and p terminal number terminal symbol 1 nc output a 2 comp a / offset null -input a 3 -input +input a 4 +input -v cc 5 -v cc +input b 6 comp b / offset null -input b 7 output output b 8 +v cc +v cc 9 comp c --- 10 nc --- nc = no connection notes: 1. -v cc shall be connected to case of metal packages. 2. for device type 02 only, +v cc (a) and +v cc (b) shall be internally connected. 3. +input is non-inverting input. 4. -input is inverting input. 5. for device types 05 and 06 only, +v cc (a) and +v cc (b) shall not be internally connected. (external connection to the same supply voltage recommended). figure 1. terminal connections ? continued. 19
mil-m-38510/101j figure 2. offset null circuits . 20
mil-m-38510/101j device type 07 figure 2. offset null circuits - continued. 21
mil-m-38510/101j figure 3. test circuit for static and dynamic tests . 22
mil-m-38510/101j units mv na na na v/v v/v db mv mv mv mv mv mv measured parameter 20 / equation v io = e1, e2, e3, e4 i io = ((e1 - e5) x 10 6 ) / r s , ((e2 - e6) x 10 6 ) / r s , 13 / ((e3 - e7) x 10 6 ) / r s , ((e4 - e8) x 10 6 ) / r s +i ib = ((e1 - e9) x 10 6 ) / r s , ((e2 ? e10) x 10 6 ) / r s , 13 / ((e3 - e11) x 10 6 ) / r s , ((e4 - e12) x 10 6 ) / r s -i ib = ((e13 - e1) x 10 6 ) / r s , ((e14 - e2) x 10 6 ) / r s , 13 / ((e15 - e31) x 10 6 ) / r s , ((e16 - e4) x 10 6 ) / r s +psrr = (e3 - e18) x 10 2 -psrr = (e3 - e19) x 10 2 cmr = 20 log |(30 x 10 3 ) / (e1 - e2)| v io adj (+) = (e3 - e20) v io adj (-) = (e3 - e21) v io adj (+) = (e3 - e22) v io adj (-) = (e3 - e23) v io adj (+) = (e3 - e34) v io adj (-) = (e3 - e35) units v v v v v v v v v v v v v v measure value e1 e2 e3 e4 e5 e6 e7 e8 e9 e10 e11 e12 e13 e14 e15 e16 e18 1 / e19 1 / e1 1 / e2 1 / e20 e21 e22 e23 e34 e35 s 6 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 s 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 s 4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 3 4 5 6 7 s 3 1 1 1 1 2 2 2 2 1 1 1 1 2 2 2 2 1 1 1 1 1 1 1 1 1 1 s 2 1 1 1 1 2 2 2 2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 switch position s 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 v -15 15 0 0 -15 15 0 0 -15 15 0 0 -15 15 0 0 5 -5 -15 +15 0 0 0 0 0 0 -v cc -5 -35 -20 - 5 -5 -35 -20 -5 -5 -35 -20 -5 -5 -35 -20 -5 -20 -10 -5 -35 -20 -20 -20 -20 -20 -20 apply (in volts) +v cc 35 5 20 5 35 5 20 5 35 5 20 5 35 5 20 5 10 20 35 5 20 20 20 20 20 20 parameter v io i io +i ib -i ib +psrr -psrr cmr v io 7 / adj(+) v io 7 / adj(-) v io 6 / adj(+) v io 6 / adj(-) v io 15 / adj(+) v io 15 / adj(-) figure 3. test circuit for static and dynamic tests - continued. 23
mil-m-38510/101j units ma ma ma v v v v v/mv v/mv v/mv v/mv v/mv v/mv measured parameter 20 / equation +i os -= i os1 -i os = i os2 i cc = i cc +v op = (e0)1 -v op = (e0)2 +v op = (e0)3 -v op = (e0)4 +a vs = 15 / (e3 - e24) -a vs = 15 / (e25 - e3) a vs = 4 / (e27 - e26) +a vs = 15 / (e3 - e30) -a vs = 15 / (e31 - e3) a vs = 4 / (e33 - e32) cmr = 20 log |(30 x 10 3 ) / (e28 - e29)| units ma ma ma v v v v v v v v v v v measure value i os1 i os2 i cc (e0)1 (e0)2 (e0)3 (e0)4 e24 e25 e26 e27 e30 e31 e32 e33 e28 1 / e29 1 / s6 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 s5 1 1 1 2 2 3 3 3 3 3 3 2 2 2 2 1 1 s4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 s3 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 s2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 switch position s1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 v -15 +15 0 -20 +20 -20 +20 -15 +15 -2 +2 -15 +15 -2 +2 +15 -15 -vcc -15 -15 -15 -20 -20 -20 -20 -20 -20 -5 -5 -20 -20 -5 -5 -20 -20 apply (in volts) +vcc 15 15 15 20 20 20 20 20 20 5 5 20 20 5 5 20 20 parameter +i os (output) -i os (output) i cc +v op r l = 10 k ? -v op r l = 10 k ? +v op r l = 2 k ? -v op r l = 2 k ? +a vs 16 / r l = 2 k ? -a vs 16 / r l = 2 k ? a vs 16 / r l = 2 k ? +a vs 16 / r l = 10 k ? -a vs 16 / r l = 10 k ? a vs 16 / r l = 10 k ? cmr 3 / figure 3. test circuit for static and dynamic tests - continued. 24
mil-m-38510/101j notes: 1 / these voltages in mv shall be measured to four place accuracy to provide required resolution in psrr and cmr. 2 / precautions shall be taken to prevent damage to the device under test during insertion into socket and change of switch positions (example, disable voltage supplies, current limit v cc , etc.). 3 / if this alternate cmr test is used, these resistors shall be of .01 percent tolerances matched to .001 percent. 4 / device types 02, 05, and 06 only, test both halves for all tests. the idle half of the dual amplifiers shall be maintained in this configuration where v1 is midway between +v cc and -v cc , or the manufacturer has the option to connect the idle half in a v io configuration such that the inputs are maintained at the same common mode voltage as the device under test. 5 / compensation: for device types 03, 04, 05, and 06 only, equals 30 pf; for device type 07 only, equals 330 pf (optional). 6 / device types 01, all case types, and device type 02, case outlines a, b, c, and d only. 7 / device types 03 and 05 only. 8 / see figure 6. noise test circuit. 9 / as required, if needed to prevent oscillation. also, proper wiring procedures shall be followed to prevent oscillation. loop response and settling time shall be consistent with the test rate such that any value has settled for at least five loop time constants before the value is measured. 10 / adequate settling time shall be allowed such that each parameter has settled to within five percent of its final value. 11 / the nulling amplifier is an m38510/10101xxx. saturation of the nulling amplifier is not allowed on test where the "e" value is measured. 12 / all resistors 0.1 percent tolerance except as noted (note 3). 13 / for device types 01, 02, 07, and 08: r s = 20 k ? . for device types 03 and 05: r s = 100 k ? . for device types 04 and 06: r s = 5.0 m ? . 14 / device type 07 only, this capacitor = 1,000 pf maximum to prevent oscillations. 15 / device type 07 only. 16 / to minimize thermal drift, the reference voltages for gain measurements (e3 and e4) shall be taken immediately prior to or after the reading corresponding to device gain (e24, e25, e26, e27, e30, e31, e32, and e33). the gain at r l = 10 k ? is essentially the gain at r l = 2 k ? is influenced by thermal gradients on the die resulting from power dissipation in the output stage. hence, it is not linear and may not even be a true approximation of the gain between other than the specified operation points. 17 / any oscillation greater that 300 mv in amplitude (pk - pk) shall be cause for device failure. 18 / although switches are depicted as toggle switches, any switching mechanism may be used provided the switching action is achieved without adversely affecting the measurement. 19 / the load resistors (2,050 ? and 11.1 k ? ) yield effective load resistances of 2 k ? and 10 k ? , respectively. 20 / the equations take into account both the loop gain of 1,000 and the scale factor multiplier, so that the calculated value is in table iii units. therefore, use measured value / units in the equations, example e1 (volts). figure 3. test circuit for static and dynamic tests - continued. 25
mil-m-38510/101j see notes on page 29 parameter pulse generator measure equation units rise time (tr) a v = 1 +50 mv amplitude t ( s), see waveform 1 t r = t s overshoot (os) a v = 1 +50 mv amplitude ? v (mv), see waveform 1 os = ( ? v / 50) x 100 % bandwidth (bw) a v = 1 +50 mv amplitude calculate bw = 0.35 / tr ( s) mhz slew rate (+sr) a v = 1 -5 v to +5 v step ? v o (volts), ? t ( s) see waveform 2 +sr = | ? v o (+) / ? t(+)| v/ s slew rate (-sr) a v = 1 +5 v to -5 v step ? v o (volts), ? t ( s) see waveform 3 -sr = | ? v o (-) / ? t(-)| v/ s figure 4. transient response test circuit . 26
mil-m-38510/101j see notes on page 30 parameter pulse generator measure equation units rise time (tr) +50 mv amplitude t (ns), see waveform 1 t r = t ns overshoot (os) +50 mv amplitude ? v (mv), see waveform 1 os = ( ? v / 50) x 100 % bandwidth (bw) +50 mv amplitude calculate bw = (0.35 x 10 3 ) / tr (ns) mhz slew rate (+sr) -5 v to +5 v step ? v o (+) (volts), ? t (+) (ns) see waveform 2 +sr = | ? v o (+) / ? t(+) x 10 -3 | v/ s slew rate (-sr) +5 v to -5 v step ? v o (-) (volts), ? t (-) (ns) see waveform 3 -sr = | ? v o (-) / ? t(-) x 10 -3 | v/ s settling time t s (+) 5 / -5 v to +5 v step t s (+), see waveform 2 t s (+) = t s (+) ns settling time t s (-) 5 / +5 v to -5 v step t s (-), see waveform 3 t s (-) = t s (-) ns figure 4. transient response test circuit - continued. 27
mil-m-38510/101j (alternate) device type 07 notes: 1. k1 is closed for small tests (tr and p.o.) and is open for large signal tests ( slew rate, ts). 2. input signal is a -50 mv to 0 mv pulse train for small signal tests and -5 v to +5 v pulse train for large signal tests. 3. tr of the input signal is < 10 ns for the small signal tests. figure 4. transient response test circuit - continued. 28
mil-m-38510/101j notes: 1. idle half of dual amplifier shall be connected during test of other half. 2. all resistor tolerances are 1 perc ent, capacitor tolerances are 10 percent and v cc = 20 v. 3. this compensation capacitor is used for device types 03, 04, 05, and 06. 4. for device types 01, 02, 03, 05, and 08, r l = 2 k ? ; for device types 04 and 06, r l = 10 k ? . 5. settling time is the interval from the beginning of the output response to the point where the output remains within the error band, in this case 2 percent. 6. cf = 10 pf 10 percent includes stray capacitance. 7. r1 may be added to the circuit. when r1 is added, its value shall be 10 k ? . when using r1, the unity gain will increase to 2. to accommodate this change in gain, the pulse generator input shall be halved. 8. c1 may be added to the circuit. when added, it shall be within the range of 0 pf to 2 pf. 9. c l capacitance specified includes stray, jig, and probe capacitance. figure 4. transient response test circuit - continued. 29
mil-m-38510/101j device types 02, 05, 06, and 08 only. notes: 1. v cc = 20 v. 2. measure: v 02 (volts, p-p) at 1 khz to accuracy of 0.1 mv or better. 3. channel separation (db) referred to input of second channel = 20 log [v 01 / (0.1 x v 02 ) ]. 4. all resistor tolerances 1 percent. 5. a 30 pf compensation capacitor is required for device types 05 and 06. figure 5. test circuit for channel separation . 30
mil-m-38510/101j noise symbol s1 measure measured equation parameter units (referred to input) value units broadband n 1 (bb) closed e 0 mv rms e 0 / 1000 v rms popcorn n 1 (pc) open e 0 mv pk e 0 / 1000 v pk notes: 1. r s = 20 k ? for device types 01, 02, 07, and 08; r s = 100 k ? for device types 03, 04, 05, and 06. 2. e 0 is measured using an rms voltmeter with a bandwidth of 10 hz to 5 khz and a peak detector simultaneously. monitor the peak test for a minimum of 15 seconds. the loop bandwidth shall be at least 5 khz. figure 6. noise test circuit . 31
mil-m-38510/101j table iii. group a inspection . unit mv " " " na " " " na " " " na " " " v/v v/v db mv mv max +4.0 " " " +40 " " " 250 " " " 250 " " " +100 +100 -7 07 1 / limits min -4.0 " " " -40 " " " -0.1 " " " -0.1 " " " -100 -100 80 +7 max +0.5 " " " +0.2 " " " +2.0 " " " +2.0 " " " +16 +16 04, 06 1 / limits min -0.5 " " " -0.2 " " " -0.1 " " " -0.1 " " " -16 -16 96 max +2.0 " " " +10 " " " 75 " " " 75 " " " +50 +50 -4 03, 05 1 / limits min -2.0 " " " -10 " " " -0.1 " " " -0.1 " " " -50 -50 80 +4 max +3.0 " " " +30 " " " 110 " " " 110 " " " +50 +50 -5 01, 02, 08 1 / limits min -3.0 " " " -30 " " " -0.1 " " " -0.1 " " " -50 -50 80 +5 conditions v cc = 20 v dc, figure 3 unless otherwise specified v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v +v cc = 10 v, -v cc = -20 v +v cc = 20 v, -v cc = -10 v v cm = +15 v 3 / 3 / test no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 mil-std -883 method 4001 4003 symbol v io i io +i ib -i ib +psrr -psrr cmr v io adj (+) v io adj (-) subgroup 1 t a = +25 c 32
mil-m-38510/101j table iii. group a inspection - continued. unit ma ma ma mv " " " v/ c na " " " pa/ c na " " ? na " " ? max +65 8 +6.0 " " " +50 +80 " " " +1,000 250 " " " 250 " " " 07 1 / limits min -65 -6.0 " " " -50 -80 " " " -1,000 -0.1 " " " -0.1 " " " max +15 0.6 +1.0 " " " +5.0 +0.4 " " " +2.5 +2.0 " " " +2.0 " " " 04, 06 1 / limits min -15 -1.0 " " " -5.0 -0.4 " " " -2.5 -1.0 " " " -1.0 " " " max +60 3.0 +3.0 " " " +15 +10 " " " +100 75 " " " 75 " " " 03, 05 1 / limits min -60 -3.0 " " " -15 -10 " " " -100 -0.1 " " " -0.1 " " " max +60 3.8 +4.0 " " " +15 +30 " " " +200 110 " " " 110 " " " 01, 02, 08 1 / limits min -60 -4.0 " " " -15 -30 " " " -200 -0.1 " " " -0.1 " " " conditions v cc = 20 v dc, figure 3 unless otherwise specified v cc = 15 v, t 25 ms v cc = 15 v, t 25 ms v cc = 15 v 5 / v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v ? v io / ? t = [v io (test 27) - v io (test 3)] x 10 v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v ? i io / ? t = [i io (test 32) - i io (test 7)] x 10 v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v test no. 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 mil-std -883 method 3011 4005 4001 symbol i os (+) 4 / i os (-) 4 / i cc v io ? v io / 6 / ? t i io ? i io / ? t +i ib -i ib subgroup 1 t a = +25 c 2 t a = +125 c see footnotes at end of table iii. 33
mil-m-38510/101j table iii. group a inspection - continued. unit ma ma ma v /v db mv mv " " " v / c na " " pa/ c max +60 3.4 +100" -5 +4.0 " " ? +20 +70 " " ? +500 08 1 / limits min -60 -100 " 80 +5 -4.0 " " " -20 -70 " " " -500 max +65 7 +150 " -7 +6.0 " " " +50 +80 " " " +1,000 07 1 / limits min -65 -150 " 80 +7 -6.0 " " " -50 -80 " " " -1,000 max +15 0.6 +16 " +1.0 " " " +5.0 +0.4 " " " +2.5 04, 06 1 / limits min -15 -16 " 96 -1.0 " " " -5.0 -0.4 " " " -2.5 max +60 2.5 +100 " -4 +3.0 " " " +18 +20 " " " +200 03, 05 1 / limits min -60 -100 " 80 +4 -3.0 " " " -18 -20 " " " -200 max +60 3.4 +100 " -5 +4.0 " " " +15 +70 " " " +500 01, 02 1 / limits min -60 -100 " 80 +5 -4.0 " " " -15 -70 " " " -500 conditions v cc = 20 v dc, figure 3 unless otherwise specified v cc = 15 v, t 25 ms v cc = 15 v, t 25 ms v cc = 15 v +v cc = 10 v, -v cc = -20 v +v cc = 20 v, -v cc = -10 v v cm = 15 v 3 / 3 / v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v ? v io / ? t = [v io (test 3) - v io (test 53)] x 12.5 v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v ? i io / ? t = [i io (test 7) - i io (test 58)] x 12.5 test no. 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 mil-std -883 method 3011 4005 4003 4003 4001 symbol i os (+) 4 / i os (-) 4 / i cc +psrr -psrr cmr v io adj(+) v io adj(-) v io ? v io / 6 / ? t i io ? i io / 6 / ? t subgroup 2 t a = +125 c 3 t a = -55 c see footnotes at end of table iii. 34
mil-m-38510/101j table iii. group a inspection - continued. unit na " " " na " " " ma ma ma v/v v/v db mv mv v " " " max 400 " " " 400 " " " 80 9 +150 +150 -7 -17 -16 07 1 / limits min -0.1 " " " -0.1 " " " -65 -150 -150 80 +7 +17 +16 max 3.0 " " " 3.0 " " " +15 0.8 +16 +16 -16 04, 06 1 / limits min -0.1 " " " -0.1 " " " -15 -16 -16 96 +16 max 100 " " " 100 " " " +60 3.5 +100 +100 -4 -16 -15 03, 05 1 / limits min -0.1 " " " -0.1 " " " -60 -100 -100 80 +4 +16 +15 max 265 " " " 265 " " " +60 4.2 +100 +100 -5 -16 -15 01, 02, 08 1 / limits min -0.1 " " " -0.1 " " " -60 -100 -100 80 +5 +16 +15 conditions v cc = 20 v dc, figure 3 unless otherwise specified v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cm = -15 v 2 / v cm = +15 v 2 / v cm = 0 v v cc = 5 v, v cm = 0 v v cc = 15 v, t 25 ms v cc = 15 v, t 25 ms v cc = 15 v 5 / +v cc = 10 v, -v cc = -20 v +v cc = 20 v, -v cc = -10 v v cm = 15 v 3 / 3 / r l = 10 k ? r l = 10 k ? r l = 2 k ? r l = 2 k ? test no. 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 mil-std -883 method 4001 3011 4005 4003 4004 symbol +i ib -i ib i os (+) 4 / i os (-) 4 / i cc +psrr -psrr cmr v io adj(+) v io adj(-) +v op -v op +v op -v op subgroup 3 t a = -55 c 4 t a = +25 c see footnotes at end of table iii. 35
mil-m-38510/101j table iii. group a inspection - continued. unit v/mv " " " " " v " " " v/mv " " " " " v " " " max -17 -16 -17 -16 07 1 / limits min 50 50 50 50 10 10 +17 +16 32 32 32 32 10 10 +17 +16 max -16 -16 04, 06 1 / limits min 80 80 20 +16 40 40 20 +16 max -16 -15 -16 -15 03, 05 1 / limits min 50 50 50 50 10 10 +16 +15 25 25 25 25 10 10 +16 +15 max -16 -15 -16 -15 01, 02, 08 1 / limits min 50 50 50 50 10 10 +16 +15 25 25 25 25 10 10 +16 +15 conditions v cc = 20 v dc, figure 3 unless otherwise specified r l = 2 k ? , v out = +15 v r l = 2 k ? , v out = -15 v r l = 10 k ? , v out = +15 v r l = 10 k ? , v out = -15 v r l = 2 k ? , v cc = 5 v, v out = 2 v r l = 10 k ? , v cc = 5 v, v out = 2 v r l = 10 k ? r l = 10 k ? r l = 2 k ? r l = 2 k ? r l = 2 k ? , v out = +15 v r l = 2 k ? , v out = -15 v r l = 10 k ? , v out = +15 v r l = 10 k ? , v out = -15 v r l = 2 k ? , v cc = 5 v, v out = 2 v r l = 10 k ? , v cc = 5 v, v out = 2 v r l = 10 k ? r l = 10 k ? r l = 2 k ? r l = 2 k ? test no. 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 mil-std -883 method 4004 symbol +a vs -a vs +a vs -a vs a vs a vs +v op -v op +v op -v op +a vs -a vs +a vs -a vs a vs a vs +v op -v op +v op -v op subgroup 4 t a = +25 c 5 t a = +125 c 6 t a = -55 c see footnotes at end of table iii. 36
mil-m-38510/101j table iii. group a inspection - continued. unit v/mv " " " " " ns % v/ s v/ s db v rms v pk ns % v/ s v/ s ns % v/ s v/ s max 40 50 25 80 40 50 40 50 07 1 / limits min 32 32 32 32 10 10 40 40 30 30 40 40 max 1,000 50 15 40 1,000 50 1,000 50 04, 06 1 / limits min 40 40 20 0.05 0.05 80 0.05 0.05 0.05 0.05 max 800 25 15 80 800 25 800 25 03, 05 1 / limits min 25 25 25 25 10 10 0.3 0.3 80 0.3 0.3 0.2 0.2 max 800 25 15 40 800 25 800 25 01, 02, 08 1 / limits min 25 25 25 25 10 10 0.3 0.3 80 0.3 0.3 0.3 0.3 conditions v cc = 20 v dc, figure 3 unless otherwise specified r l = 2 k ? , v out = +15 v r l = 2 k ? , v out = -15 v r l = 10 k ? , v out = +15 v r l = 10 k ? , v out = -15 v r l = 2 k ? , v cc = 5 v, v out = 2 v r l = 10 k ? , v cc = 5 v, v out = 2 v figure 4 figure 4 figure 4, a v = 1, v in = -5 v to +5 v figure 4, a v = 1, v in = +5 v to -5 v figure 5 bw = 5 khz, figure 6 bw = 5 khz, figure 6 t a = +125 c, figure 4 t a = +125 c, figure 4 t a = +125 c, figure 4, a v = 1, v in = -5 v to +5 v t a = +125 c, figure 4, a v = 1, v in = +5 v to -5 v t a = -55 c, figure 4 t a = -55 c, figure 4 t a = -55 c, figure 4, a v = 1, v in = -5 v to +5 v t a = -55 c, figure 4, a v = 1, v in = +5 v to -5 v test no. 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 mil-std -883 method 4002 4002 4002 symbol +a vs -a vs +a vs -a vs a vs a vs tr(t r ) tr(os) sr(+) sr(-) cs 7 / ni (bb) ni (pc) tr(t r ) tr(os) sr(+) sr(-) tr(t r ) tr(os) sr(+) sr(-) subgroup 6 t a = -55 c 7 t a = +25 c 8a t a = +125 c 8b t a = -55 c see footnotes at end of table iii. 37
mil-m-38510/101j table iii. group a inspection - continued. unit ns ns ns ns ns ns max 800 800 1,200 1,200 1,200 1,200 07 1 / limits min max 04, 06 1 / limits min max 03, 05 1 / limits min max 01, 02, 08 1 / limits min conditions v cc = 20 v dc, figure 3 unless otherwise specified t a = +25 c, figure 4 t a = +25 c, figure 4 t a = +125 c, figure 4 t a = +125 c, figure 4 t a = -55 c, figure 4 t a = -55 c, figure 4 test no. 122 123 124 125 126 127 mil-std -883 method 4002 symbol t s (+) t s (-) t s (+) t s (-) t s (+) t s (-) subgroup 12 t a =+25 c 13a t a =+125 c 13b t a =-55 c 1 / for devices marked with the ?q? ce rtification mark, the parameters listed herein may be guaranteed if not tested to the li mits specified herein in accordance with the manufacturer?s qm plan. limits apply to both halves of dual devices (02, 05, 06, and 08) independently, and slew rate limit for device 08 is 0.4 v/ s at all temperatures (tests 109, 110, 116, 117, 120, 121). 2 / v cm is achieved by algebraically subtracting the common mode voltage from each supply and algebraically adding the common mode vol tage to v (example, for v cm = -15 v, +v cc = +35 v, -v cc = -5 v, v = -15 v). 3 / v io (adj) is not performed on device type 02, case i only, or on device types 04, 06, and 08 all case types. 4 / due to the significant power dissipation and associated device heating, these tests shall always be the last tests performe d in any given sequence, followed by operational verification (example, such tests as v opp , a vs , tr, sr). 5 / limit shown applied to single devices (01, 03, and 04) only. the maximum quiescent i cc for dual devices (02, 05, 06, and 08) is twice that shown for single devices. 6 / tests 29, 34, 55, and 60 which require a read and record measurement plus a calculation, may be omitted except when subgrou ps 2 and 3 are being accomplished for group a sampling inspection and group c and d endpoint measurements. 7 / applies to device types 02, 05, and 06 only. 38
mil-m-38510/101j table iv. group c end point electrical parameters . (t a = +25 c, v cc = 20 v, v cm = 0 v) table iii test no. test 01, 02, 08 03, 05 unit limit delta limit delta min max min max min max min max 3 v io -3.0 +3.0 -0.5 +0.5 -2.0 +2.0 -0.5 +0.5 mv 11 +i ib +1.0 +110 -12 +12 +1.0 +75 -7.5 +7.5 na 15 -i ib +1.0 +110 -12 +12 +1.0 +75 -7.5 +7.5 na table iii test no. test 04, 06 07 unit limit delta limit delta min max min max min max min max 3 v io -0.5 +0.5 -0.25 +0.25 -4.0 +4.0 -1.0 +1.0 mv 11 +i ib -0.1 +2.0 -0.5 +0.5 +1.0 250 -25 +25 na 15 -i ib -0.1 +2.0 -0.5 +0.5 +1.0 250 -25 +25 na 39
mil-m-38510/101j 4.3 qualification inspection . qualification inspection shall be in accordance with mil-prf-38535. 4.4 technology conformance inspection (tci) . technology conformance inspection shall be in accordance with mil- prf-38535 and herein for groups a, b, c, and inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . group a inspection shall be in accordance with table iii of mil-prf-38535 and as follows: a. subgroups 9, 10, and 11 shall be omitted. b. tests shall be as specified in table ii herein. c. subgroups 12 and 13 (for device type 07 only) sh all be added to table iii of mil-prf-38535 for class s only. the class s sample size series for subgroup 12 shall be 5 and for subgroup 13 the class s sample size series shall be 7. 4.4.2 group b inspection . group b inspection shall be in accordance with table ii of mil-prf-38535. 4.4.3 group c inspection . group c inspection shall be in accordance with table iv of mil-prf-38535 and as follows: a. end point electrical parameters shall be as specified in table ii herein. b. subgroups shall be added to group c inspection and shall consist of subgroups 8, 12, and 13 respectively as specified in table iii herein. the sample size series for subgroup 12 shall be 5, and subgroup 13 shall be 7 for class b devices (see mil-prf-38535, appendix d). c. the steady-state life test duration, test condition, and te st temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-38535. the burn-in test circuit shall be maintained under document control by the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. 4.4.4 group d inspection . group d inspection shall be in accordance with table v of mil-prf-38535. end point electrical parameters shall be as specified in table ii herein. 4.5 methods of inspection . methods of inspection shall be specified and as follows. 4.5.1 voltage and current . all voltage values given, except the input offset voltage (or differential voltage) are referenced to the external zero reference level of the supply voltage. currents given are conventional current and positive when flowing into the referenced terminal. 4.5.2 burn-in and life test cooldown procedure . when devices are measured at +25 c following application of the steady state life or burn-in condition, they shall be cooled to within 10 c of their power stable condition at room temperature prior to removal of the bias. 40
mil-m-38510/101j 5. packaging 5.1 packaging requirements. for acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). when actual packaging of materiel is to be performed by dod personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. packaging requirements are maintained by the inventory control point's packaging activity within the military department of defense agency, or within the military department's system command. packaging data retr ieval is available from the managing military department's or defense agency's automated packaging files, cd-rom products, or by contacting the responsible packaging activity. 6. notes (this section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 intended use. microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 acquisition requirements . acquisition documents should specify the following: a. title, number, and date of the specification. b. complete part number (see 1.2). c. requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. requirements for certificate of compliance, if applicable. e. requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable. f. requirements for failure analysis (including required test condition of mil-std-883, method 5003), corrective action and reporting of results, if applicable. g. requirements for product assurance options. h. requirements for special carriers, lead lengths, or lead forming, if applicable. these requirements shall not affect the part number. unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the government. j. requirements for "jan" marking. 6.3 superseding information . the requirements of mil-m-38510 have been superseded to take advantage of the available qualified manufacturer listing (qml) system provided by mil-prf-38535. previous references to mil-m-38510 in this document have been replaced by appropriate references to mil-prf-38535. all technical requirements now consist of this specification and mil-prf-38535. the mil-m-38510 specification sheet number and pin have been retained to avoid adversely impacting existing government logi stics systems and contractor's parts lists. 41
mil-m-38510/101j 6.4 qualification . with respect to products requiring qualification, aw ards will be made only for products which are, at the time of award of contract, qualified for inclusion in qualif ied manufacturers list qml-38535 whether or not such products have actually been so listed by that date. the attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that t hey propose to offer to the federal government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. information pertaining to qualification of products may be obtained from dscc-vq, 3990 e. broad street, columbus, ohio 43123-1199. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil-prf-38535 and mil-hdbk-1331. 6.6 logistic support . lead materials and finishes (see 3.4) are interchangeable. unless otherwise specified, microcircuits acquired to government logistic support will be acquired to device class b (see 1.2.2), and lead material and finish a (see 3.4). longer length leads and lead forming shall not affect the part number. 6.7 substitutability . the cross-reference information below is presented for the convenience of users. microcircuits covered by this specification will functionally replace the list ed generic-industry type. generic-industry microcircuit types may not have equivalent operational performance characterist ics across military temperature ranges or reliability factors equivalent to mil-m-38510 device types and may have slight physical variations in relation to case size. the presence of this information shall not be deemed as permitting substituti on of generic-industry types for mil-m-38510 types or as a waiver of any of the provisions of mil-prf-38535. military device type generic-industry type 01 741a 02 747a (with common +v cc ) 03 lm101a 04 lm108a 05 lh2101a 06 lh2108a 07 lm118 08 1558 6.7 changes from previous issue . asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes. custodians: preparing activity: army - cr dla - cc navy - ec air force - 11 project 5962-1950 nasa - na dla - cc review activities: army ? hd, mi, sm navy - as, cg, mc, sh, td air force ? 03, 19, 99 42
standardization document improvement proposal instructions 1. the preparing activity must complete blocks 1, 2, 3, and 8. in block 1, both the document number and revision letter shoul d be given. 2. the submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity. 3. the preparing activity must provide a reply within 30 days from receipt of the form. note: this form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on c urrent contracts. comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. i recommend a change: 1. document number mil-m-38510/101j 2. document date (yyyymmdd) 2003/02/07 3. document title microcircuits, linear, operational amplifiers, monolithic silicon, part number m38510/10101 through m38510/10108 4. nature of change (identify paragraph number and include proposed rewrite, if possible. attach extra sheets as needed.) 5. reason for recommendation 6. submitter a. name (last, first middle initial) b. organization c. address (include zip code) d. telephone (include area code) (1) commercial (2) dsn (if applicable) 7 . date submitted (yyyymmdd) 8. preparing activity a. name rick officer b. telephone (include area code (1) commercial (2) dsn 614-692-0518 850-0518 c. address (include zip code) dscc-vas 3990 east broad street columbus, ohio 43216-5000 if you do not receive a reply within 45 days, contact: defense standardization program office (dlsc-lm) 8725 john j. kingman road, suite 2533 fort belvoir, virginia 22060-6221 telephone (703)767-6888 dsn 427-6888 dd form 1426, feb 1999 (eg) previous editions are obsolete. whs/dior, feb 99

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